GlobalFoundries details FDX Fusion, aiming for 7nm-class performance without EUV

[DeadChat58]

GlobalFoundries has found a way to get modern chip performance without the most expensive equipment. Tom's Hardware reports on FDX Fusion, a new chipmaking process that uses older DUV lithography rather than costly EUV machines, built at GlobalFoundries' fab in Dresden

It is an FD-SOI planar transistor process, a different approach from the FinFET and gate all around transistors used at the cutting edge. It packs about 14 million gates per square millimetre, similar to Samsung's 8nm class processes

Compared with GlobalFoundries' current FDX generation, it targets 30 percent more performance and 40 percent less power. The 7nm class label refers to performance and power rather than how densely transistors are packed

The design kit for customers is due in mid 2027, with first customer production in 2028 and high volume manufacturing in 2030. First silicon is still at the lab stage

Avoiding EUV keeps costs down, which could make capable chips more affordable for things like cars, sensors and IoT devices. Building it in Dresden also strengthens Europe's chip supply. The 2030 timeline is long, but chip manufacturing always moves slowly

Is there still a place for older chipmaking methods? And how important is it for Europe to make its own chips?

GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools - company targets 2030 for high-volume manufacturing, with planar transistors in towwww.tomshardware.com